Asynchronous VLSI and Architecture
Yale

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Three Dimensional Integration

    
     3D characterization
This research studies the impact of three dimensional integration on system efficiency beyond stacking heterogenous technologies and memory stacking. We designed a very simple 3D asynchronous FPGA architecture, as well as fabricated a chip to characterize thermal properties and variability in 3D integrated circuits.
Collaborators

Sandip Tiwari

Students

Benjamin Hill (Ph.D. 2015)
Carlos Tadeo Ortega Otero (Ph.D. 2014)
Jonathan Tse (Ph.D. 2015)

Publications

Jonathan Tse, Benjamin Hill, and Rajit Manohar. A Bit of Analysis on Self-Timed Single-Bit On-Chip Links. Proceedings of the 19th IEEE International Symposium on Asynchronous Circuits and Systems (ASYNC), May 2013. (abstract, pdf)

T. Robert Harris, Shivam Priyadarshi, Samson Melamed, Carlos Otero, Rajit Manohar, Steven R. Dooley, Nikhil M. Kriplani, W. Rhett Davis, Paul D. Franzon, and Michael B. Steer. A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits. IEEE Transactions on Components and Packaging Technologies, 2(4):660–667, April 2012. (abstract)

S. Priyadarshi, T. R. Harris, S. Melamed, C. Otero, N. Kriplani, C. E. Christoffersen, R. Manohar, S. R. Dooley, W. R. Davis, P. D. Franzon, and M. B. Steer. Dynamic electrothermal simulation of three dimensional integrated circuits using standard cell macromodels. IET Circuits, Devices, and Systems, 6(1):35–44, January 2012.

Filipp Akopyan, Carlos Tadeo Ortega Otero, David Fang, Sandra Jackson, and Rajit Manohar. Variability in 3-D Integrated Circuits. Proceedings of the IEEE Custom Integrated Circuits Conference (CICC), September 2008. (abstract, pdf)

David Fang, Christopher LaFrieda, Song Peng, and Rajit Manohar. A 3-Tier Asynchronous FPGA. Proceedings of the 23rd International VLSI/ULSI Multilevel Interconnection Conference (VMIC), September 2006. (abstract, pdf)

Song Peng and Rajit Manohar. Yield Enhancement of Asynchronous Logic Circuits through 3-Dimensional Integration Technology. Proceedings of the ACM Great Lakes Symposium on VLSI (GLVLSI), April 2006. (abstract, pdf)

Christianto C. Liu, Jeng-Huei Chen, Rajit Manohar, and Sandip Tiwari. Mapping Multimedia Applications to 3-D System-on-Chip. Proceedings of the 2005 IEEE International Symposium on Circuits and Systems, May 2005.


 
  
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